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First release of Cadence AWR is available. AWR version 15 is ideal for efficient development of high-frequency printed circuit boards in millimeter wave (mmWave) to microwave range. It delivers a large number of parameterized RF components that can be simulated with different solvers depending on the application. Update contains many innovations for RF design of filters, amplifiers or antennas.
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QIR1 of OrCAD / Allegro contains many new features. The solutions for efficient PCB design include usability improvements and a modernized look and feel of PCB Editor. All customers under maintenance can download the update for free.
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More than half of all electronic failures are caused by thermal overload. FlowCAD offers several practical solutions to analyze and eliminate electrical and thermal hotspots and their causes. Until 31 March 2020, any company can have a design tested by us free of charge. Send us your design as a .brd or IPC-2581 file and you will receive a free analysis back.
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Beckhoff is known for its wide range of PC-based automation components and solutions for industrial use. Fanless ultra-compact industrial PC C6025 is very reliable and robust in terms of EMI, signal and power integrity. Thousand of rules had to be observed in design process an this was easily managed in Allegro Constraint Manager. Real time design rule checks provided the designer with immediate feedback.
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OMICRON creates highly reliable designs with OrCAD. With more than 1300 components on a 12-layer PCB the layout is dense and the formfactor is adding complexity to the design task. Online design rule checks helped to respect all constraints and build a design following all design rules for power and high-speed. The rules have to be compliant with IEC standards for electrical power systems.
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Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and Allegro PCB platforms. Fast and accurate parallel simulation enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations. Engineers can combine Cadence Celsius and Sigrity in an accurate electrical and thermal co-simulation (steady-state and transient) system-level thermal simulation for PCB and IC-Packaging based on the actual flow of electrical power.
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