Cadence Celsius Thermal Solver is a complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems for PCBs and physical enclosures. Based on a production-proven, massively parallel architecture that delivers high performance without sacrificing accuracy, the Celsius Thermal Solver seamlessly integrates with the Allegro PCB Design platform. This enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.Key Benefits:
Electrical-thermal co-simulation can dramatically improve the system design process, allowing thermal design adaptation to be done much earlier. The Cadence Celsius Thermal Solver is a complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems PCBs and complete systems. The Celsius solver can help detect and mitigate thermal issues early in the design process.
Transient and steady-state simulation respects, that power and temperature are changing over time, while the product is in use. Co-simulation between thermal and electrical, because it interacts with each other. Temperature will effect electrical resistance. Electrical resistance will introduce an additional thermal source in the system. Both effects can no longer be seperated with increasing power and smaller systems.
Celsius thermal solver can handle any 3D objects in high resulution. With a combination of Finite Element Method (FEM) and Computational Fluid Dynamics (CFD) enables the accurate simulation of temperatures and predict the heated air flow and heat dissipation in the system.
Accurate simulation of multiphysical effects requires 3D full resolution structures and small time steps. This large number of maxwell equations can be solved with massive parallel computational techniques from Cadence. This parallelization technology enables to use multi-core compute resources, multiple standard computers (i.e. 16 MB RAM), or flexible resources in the cloud to scale the computing power without limits. Both meshing and physical structures can be partitioned and parallelized across available computing resources.
To perform 3D simulation the accuracy of start parameters is important. With the deep integration of Celsius in the Cadence design flow, accurate values for power and power models provide real values for the simulation. The accuracy in simulation over time depends on the initial values. Due to the integration no data will be translated.
Works with Microsoft Windows and Linux and has interfaces to PCB and IC package layout databases from OrCAD, Mentor Graphics, Altium, Zuken, and AutoCAD.
reads the stackup and other information directly from the Allegro .brd database. The solver is highly optimized for meshing of 3D planar layered structures like PCBs and solved partially as 2.5D Model for increased simulation speed with full accuracy.
Celsius opens directly the Allegro .brd database and can import STEP models for 3D structures. This accuracy in modelling is required for components, connectors and cooling devices in a steady-state and transient simulation.
CFD (computerize fluid dynamics) is a method to simulate fluids and air flows. It is used to model and simulate convection, conduction, radiation, and heat transfer in an electromechanical system. The setup of fans and a test chamber is quick and easy.