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Celsius Thermal Simulation

Celsius Thermal Simulation

Cadence Celsius Thermal Solver is a complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems for PCBs and physical enclosures. Based on a production-proven, massively parallel architecture that delivers high performance without sacrificing accuracy, the Celsius Thermal Solver seamlessly integrates with the Allegro PCB Design platform. This enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.

Key Benefits:
  • Massively parallel execution without compromising accuracy
  • Integration with Allegro simplifies design iterations
  • Accurate transient and steady-state analysis for electrical-thermal co-simulation
  • Combination of FEA and CFD provides total system analysis
Transient and steady state thermal simulation of PCBs with enclosure

Allegro Overview Video 2020

FloWare Library Plot
17:31

Electrical-thermal co-simulation can dramatically improve the system design process, allowing thermal design adaptation to be done much earlier. The Cadence Celsius Thermal Solver is a complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems PCBs and complete systems. The Celsius solver can help detect and mitigate thermal issues early in the design process.

Product Features

Steady-state Thermal Analysis
Transient and Steady-State Thermal Analysis

Steady-State and Transient Electro / Thermal Co-Simulation

Transient and steady-state simulation respects, that power and temperature are changing over time, while the product is in use. Co-simulation between thermal and electrical, because it interacts with each other. Temperature will effect electrical resistance. Electrical resistance will introduce an additional thermal source in the system. Both effects can no longer be seperated with increasing power and smaller systems.

Co-Simulation with FEA and CFD
Co-Simulation with FEA and CFD

Co-Simulation with FEA, FEM, and CFD

Celsius thermal solver can handle any 3D objects in high resulution. With a combination of Finite Element Method (FEM) and Computational Fluid Dynamics (CFD) enables the accurate simulation of temperatures and predict the heated air flow and heat dissipation in the system.

Massive Parallel Computational Solver
Massive Parallel Computational Solver

Massive Parallel Computational Solver

Accurate simulation of multiphysical effects requires 3D full resolution structures and small time steps. This large number of maxwell equations can be solved with massive parallel computational techniques from Cadence. This parallelization technology enables to use multi-core compute resources, multiple standard computers (i.e. 16 MB RAM), or flexible resources in the cloud to scale the computing power without limits. Both meshing and physical structures can be partitioned and parallelized across available computing resources.

Allegro Integration
Allegro Integration

Allegro Integration

To perform 3D simulation the accuracy of start parameters is important. With the deep integration of Celsius in the Cadence design flow, accurate values for power and power models provide real values for the simulation. The accuracy in simulation over time depends on the initial values. Due to the integration no data will be translated.
Works with Microsoft Windows and Linux and has interfaces to PCB and IC package layout databases from OrCAD, Mentor Graphics, Altium, Zuken, and AutoCAD.

Simulation of Layered-Structures
Simulation of Layered-Structures

Simulation of Layered-Structures

reads the stackup and other information directly from the Allegro .brd database. The solver is highly optimized for meshing of 3D planar layered structures like PCBs and solved partially as 2.5D Model for increased simulation speed with full accuracy.

Simulation of 3D-Structures
Simulation of 3D-Structures

Simulation of 3D-Structures

Celsius opens directly the Allegro .brd database and can import STEP models for 3D structures. This accuracy in modelling is required for components, connectors and cooling devices in a steady-state and transient simulation.

Simulation of 3D-Structures
Simulation of 3D-Structures

Simulation of Air Flow

CFD (computerize fluid dynamics) is a method to simulate fluids and air flows. It is used to model and simulate convection, conduction, radiation, and heat transfer in an electromechanical system. The setup of fans and a test chamber is quick and easy.