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With continuous miniaturization, increasing form factors, and higher demand for reliability the number of PCB design rules grows exponentially year of year. At the same time the development time is shrinking. Managing Constraints has become the key task in PCB Design.
In-design Analysis can be used by any PCB designer as workflows in the PCB Editor of OrCAD/Allegro. The workflows help, similar to a spell checker, to quickly run standardized simulations in the background while routing. You get immediate feedback if a change makes the layout better or worse. At the earliest stage, better geometries can be created electrically and changes or redesigns late in the development process can be avoided.
The Cadence Release 2021 was released in January. It includes exciting new features for you to evaluate and to work with. System Capture has been expanded by various reliability checks for schematic audits or electrical and thermal stress analysis. You can get a first impression in the video. Our Support Team is happy to answer your questions.
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FlowCAD is looking for the antenna designer 2021. A not optimal antenna is integrated in the demo board. You can do better! Tell us how and why. Simulate the circuit using AWR Microwave Office (free trial available) and submit your suggestions for improvement by March 15, 2021. The FlowCAD jury will present different approaches of the submissions and choose the winners.
More than half of all electronic failures are caused by thermal overload. FlowCAD offers several practical solutions to analyze and eliminate electrical and thermal hotspots and their causes. Until 31 March 2020, any company can have a design tested by us free of charge. Send us your design as a .brd or IPC-2581 file and you will receive a free analysis back.
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Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and Allegro PCB platforms. Fast and accurate parallel simulation enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations. Engineers can combine Cadence Celsius and Sigrity in an accurate electrical and thermal co-simulation (steady-state and transient) system-level thermal simulation for PCB and IC-Packaging based on the actual flow of electrical power.