Integrated with Cadence PCB and IC package design tools, the Sigrity solutions for signal integrity (SI) and power integrity (PI) provide advanced analysis both pre- and post-layout. Operating early in the design cycle allows for “what if” scenario exploration, sets more accurate design constraints, and reduces design iterations. Sigrity tools read and write directly to the Allegro PCB and IC package design database for fast and accurate integration of results. It provides a SPICE-based simulator and embedded field solvers for extraction of 2D and 3D structures. It supports transistor-level and behavioral I/O modeling, including power-aware simulation using IBIS models. Parallel bus and serial channel architecture can be explored pre-layout to compare alternatives, or post-layout for a comprehensive analysis of all associated signals.
The Cadence Sigrity OptimizePI environment automates the selection and placement of decoupling capacitors (decaps) to assure products meet power-delivery network (PDN) performance targets at lowest possible cost. The Sigrity OptimizePI approach may be applied to PCBs and IC packages, or a combination of both. Sigrity analysis technologies are augmented with an efficient optimization engine to uniquely enable cost-based PDN design. Sigrity OptimizePI capabilities can fully explore the feasible design space and identify a range of candidate decap implementations, enabling users to pinpoint the ideal approach.
Sigrity OptimizePI datasheet
To reduce simultaneous switching noise, signal coupling, and target voltage ripple, Sigrity PowerSI provides fast, accurate, and detailed electrical analysis of full IC packages or PCBs. It can be used pre-layout to develop power- and signal-integrity guidelines, as well as post-layout to verify performance and improve a design without a prototype. With electromagnetic (EM) field solver technology you can readily perform a broad range of studies to identify trace and via coupling issues, power / ground fluctuations caused by simultaneously switching outputs, and design regions that are under or over voltage targets.
Sigrity PowerSI datasheet
To accelerate your IC package and PCB power-integrity and signal-integrity analysis as well as electromagnetic interface (EMI) / electromagnetic compatibility (EMC) analysis, Sigrity PowerSI 3D EM Extraction Option three-dimensional (3D) full-wave and quasi-static electromagnetic (EM) field solver provides S-parameter model extraction using model reduction technology. For accuracy with complex 3D structures, the cloud-ready tool features adaptive finite element mesh (FEM) refinement technology.
Sigrity PowerSI-3D datasheet
To ensure you achieve reliable power delivery, Cadence Sigrity PowerDC provides efficient DC analysis for signoff of IC package and PCB designs, including electrical/thermal co-simulation to maximize accuracy. PowerDC technology quickly pinpoints excessive IR drop, along with areas of excess current density and thermal hotspots to minimize your design’s risk of field failure.
Sigrity SystemSI signal integrity (SI) solutions provide a comprehensive and flexible SI analysis environment for accurately assessing high-speed, chip-to-chip system designs. A block-based editor makes it easy to get started. The solutions support industry-standard model formats and automatically connect the models. With a unique combination of frequency domain, time domain, and statistical analysis techniques, you can be confident of achieving robust parallel bus and serial link interface implementations.
Sigrity SystemSI datasheet
Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and Allegro PCB platforms. Fast and accurate parallel simulation enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process - reducing electronic system development iterations. Engineers can combine Cadence Celsius and Sigrity in an accurate electrical and thermal co-simulation (steady-state and transient) system-level thermal simulation for PCB and IC-Packaging based on the actual flow of electrical power.
Celsius Thermal Solver datasheet Celsius Thermal Solver whitepaper
Clarity 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. Clarity 3D Solver resolve the most complex electromagnetic (EM) challenges when designing systems for 5G, wifi-6, high-performance computing (HPC), and machine learning applications with gold-standard accuracy. This multiprocessing technology enables to deliver virtually unlimited capacity and 10X speed required to efficiently and effectively address these larger and more complex structures. It creates highly accurate S-parameter models for use in SI, PI, and EMC analysis, enabling simulation results that match lab measurement, even at 112Gbps+ data transfer speeds.
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