NEXTRA MID DesignNEXTRA MID Design is a design environment for 3D electrical carriers called MID (Molded Interconnect Devices). MID contain a 3D mechanical carrier with several 3D surfaces and routing can be done on all surfaces. This routing and component placing on the surface of the 3D geometry will make the use of additional PCBs for electrical functionality redundant. As a result, weight and fitting space can be effectively reduced. Electrical components are placed on flat surface areas.
The three-dimensional circuit carriers are injection molded from a modified polymer material. The modification allows laser activation of routing and component footprints on the surface of the circuit carrier. The activated areas become metallized in a chemical metallization bath in order to build conductive tracks. Multiple technologies are used and supported by NEXTRA:
- LPKF-LDS process (laser direct structuring) (additive and subtractive)
- Insert moduling
- Two-shot injection moulding
- Hot embossing